The Dimensity 6300 is the most recent midrange chipset from MediaTek. This is the follow-up to the Dimensity 6100+ from the previous year, with an overclocked primary Cortex-A76 CPU cluster that operates at 2.4 GHz instead of 2.2 GHz. Six Cortex-A55 cores running at 2GHz connect the two Cortex-A76 cores. The 6nm technology used by TSMC to produce the Dimensity 6300 has a Mali-G57 MC2 GPU. According to MediaTek, the new chip should provide a 10% increase in CPU performance over the 6100+ that is currently in use. The MediaTek UltraSave 3.0+ technology for power conservation and an integrated 5G modem that complies with the 3GPP Release 16 standard are further characteristics of the Dimensity 6300. The chip can power displays with a resolution of up to 1080 x 2520 pixels and supports the same LPDDR4x RAM and UFS 2.2 storage as its predecessor. It has dual-band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.2, and up to 108MP primary cameras. Later this month, the Realme C65 5G is anticipated to be the first phone to be released with the Dimensity 6300.